Cooling Performance of Heat Sinks Used in Electronic Devices

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for their time and efforts in reviewing the proposals and dissertations and their helpful advices. My sincere gratitude goes to DARPA and Intel Corporation for their financial support. I would also like to thank the University of Maryland College Park for their financial support in the form of Graduate School Fellowship. I would also like to take this opportunity to express my appreciations and...

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ژورنال

عنوان ژورنال: MATEC Web of Conferences

سال: 2018

ISSN: 2261-236X

DOI: 10.1051/matecconf/201817102003